TG-APC93 Non-Silicone Thermal Pad
Description
— Thermal Conductivity : 2.1W/mk
— Hardness : Shore00 55
— Breakdown Voltage: 10.2 KV/mm
TG-APC93 Non-silicone thermal pad is used to fill the uneven space between the heat source and the heat sink and remove the heat generated by electronic products to achieve the effect of cooling and heat dissipation;
can effectively replace non-silicone thermal paste and mechanical fixation characteristics.
— No low molecular weight silicone and volatile silicone oil
— The material is soft and supple
— Low thermal resistance
— Electrical insulation
— Good thermal conductivity
— Suitable for sensitive electronic originals
Brands
T-Global
— Thermal Conductivity : 2.1W/mk
— Hardness : Shore00 55
— Breakdown Voltage: 10.2 KV/mm
TG-APC93 Non-silicone thermal pad is used to fill the uneven space between the heat source and the heat sink and remove the heat generated by electronic products to achieve the effect of cooling and heat dissipation;
can effectively replace non-silicone thermal paste and mechanical fixation characteristics.
— No low molecular weight silicone and volatile silicone oil
— The material is soft and supple
— Low thermal resistance
— Electrical insulation
— Good thermal conductivity
— Suitable for sensitive electronic originals