TG-A96AB Potting Compound

Description

Thermal Conductivity 2.6W / mK

Epoxy based material with high hardness for support

Protect components from any effect after curing

Can be applied with dispenser

Room temperature or heating curing


Brands

T-Global

Thermal Conductivity 2.6W / mK

Epoxy based material with high hardness for support

Protect components from any effect after curing

Can be applied with dispenser

Room temperature or heating curing


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