TG-A96AB Potting Compound
Description
Thermal Conductivity 2.6W / mK
Epoxy based material with high hardness for support
Protect components from any effect after curing
Can be applied with dispenser
Room temperature or heating curing
Brands
T-Global
Thermal Conductivity 2.6W / mK
Epoxy based material with high hardness for support
Protect components from any effect after curing
Can be applied with dispenser
Room temperature or heating curing